| Parameters |
| Mounting Type |
Through Hole |
| Package / Case |
24-DIP (0.300, 7.62mm) |
| Surface Mount |
NO |
| Operating Temperature |
-40°C~85°C TA |
| Packaging |
Tube |
| Series |
74ACTQ |
| JESD-609 Code |
e3 |
| Pbfree Code |
yes |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
24 |
| Terminal Finish |
MATTE TIN |
| Technology |
CMOS |
| Voltage - Supply |
4.5V~5.5V |
| Terminal Position |
DUAL |
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE |
| Number of Functions |
1 |
| Supply Voltage |
5V |
| Terminal Pitch |
2.54mm |
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE |
| Pin Count |
24 |
| JESD-30 Code |
R-PDIP-T24 |
| Qualification Status |
COMMERCIAL |
| Output Type |
3-State |
| Number of Elements |
1 |
| Supply Voltage-Max (Vsup) |
5.5V |
| Supply Voltage-Min (Vsup) |
4.5V |
| Number of Ports |
2 |
| Family |
ACT |
| Current - Output High, Low |
24mA 24mA |
| Logic Type |
Transceiver, Non-Inverting |
| Output Polarity |
TRUE |
| Number of Bits per Element |
8 |
| Width |
7.62mm |
| RoHS Status |
ROHS3 Compliant |
74ACTQ646SPC Overview
Logical driver uses a neat 24-DIP (0.300, 7.62mm) package. Tube external packaging. Available in Through Hole. Voltage buffer adopts Transceiver, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 4.5V~5.5V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 1 elements are put into use. Digital buffer is one of the 74ACTQ series devices. 24 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. ACT family part. 24 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 8 bits for each element. To supply the device, a minimum voltage of 4.5V is a must.
74ACTQ646SPC Features
74ACTQ646SPC Applications
There are a lot of Rochester Electronics, LLC 74ACTQ646SPC Buffers & Transceivers applications.
- Tuner
- Low power, low voltage systems
- Wireless security systems
- Laser diode bonding
- 1x/2x Fiber Channel
- Bar, KTV wireless entertainment
- Telecom and datacom networking applications
- Carrier phase observations
- Ethernet circuitry
- Cell phones