| Parameters |
| Package / Case |
1517-BBGA, FCBGA |
| Supplier Device Package |
1517-FBGA, FC (40x40) |
| Operating Temperature |
0°C~85°C TJ |
| Packaging |
Tray |
| Series |
Arria V SX |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Base Part Number |
5ASXFB5 |
| Number of I/O |
MCU - 208, FPGA - 540 |
| Speed |
700MHz |
| RAM Size |
64KB |
| Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals |
DMA, POR, WDT |
| Connectivity |
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture |
MCU, FPGA |
| Primary Attributes |
FPGA - 462K Logic Elements |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Its package is 1517-BBGA, FCBGA.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the Arria V SX series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 462K Logic Elements.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 208, FPGA - 540 I/Os in total are included in this SoC part.By searching 5ASXFB5, you will find system on chips with similar specs and purposes.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
64KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
5ASXFB5H6F40C6NES System On Chip (SoC) applications.
- PC peripherals
- Central inverter
- Smart appliances
- Smartphone accessories
- Temperature
- DC-input BLDC motor drive
- Embedded systems
- Industrial transport
- Communication interfaces ( I2C, SPI )
- Special Issue Information