 
    | Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks | 
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | 
| Contact Plating | Lead, Tin | 
| Mount | Through Hole | 
| Transistor Element Material | SILICON | 
| Packaging | Bulk | 
| Published | 2007 | 
| JESD-609 Code | e0 | 
| Pbfree Code | no | 
| Part Status | Active | 
| Number of Terminations | 2 | 
| ECCN Code | EAR99 | 
| Terminal Finish | TIN LEAD | 
| HTS Code | 8541.29.00.95 | 
| Max Power Dissipation | 90W | 
| Terminal Position | BOTTOM | 
| Terminal Form | PIN/PEG | 
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | 
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | 
| JESD-30 Code | O-MBFM-P2 | 
| Qualification Status | Not Qualified | 
| Polarity/Channel Type | NPN | 
| Collector Emitter Voltage (VCEO) | 80V | 
| Max Collector Current | 7A | 
| JEDEC-95 Code | TO-66 | 
| DC Current Gain-Min (hFE) | 20 | 
| RoHS Status | Non-RoHS Compliant |