| Parameters | |
|---|---|
| Factory Lead Time | 20 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Contact Plating | Lead, Tin |
| Mount | Through Hole |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Additional Feature | METALLURGICALLY BONDED |
| HTS Code | 8541.10.00.50 |
| Max Power Dissipation | 500mW |
| Technology | ZENER |
| Terminal Position | AXIAL |
| Terminal Form | WIRE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Diode Type | ZENER DIODE |
| Power Dissipation | 500mW |
| Case Connection | ISOLATED |
| Test Current | 7.5mA |
| Reference Voltage | 9V |
| Zener Voltage | 9V |
| Voltage Tol-Max | 5% |
| JEDEC-95 Code | DO-35 |
| Voltage Tolerance | 5% |
| Voltage Temp Coeff-Max | 0.09mV/°C |
| RoHS Status | Non-RoHS Compliant |