1N6536
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Contact Plating | Lead, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | A, Axial |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 1997 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| HTS Code | 8541.10.00.80 |
| Terminal Form | WIRE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | O-LALF-W2 |
| Qualification Status | Not Qualified |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 10μA @ 400V |
| Voltage - Forward (Vf) (Max) @ If | 1.5V @ 1A |
| Case Connection | ISOLATED |
| Forward Current | 1A |
| Output Current-Max | 1A |
| Current - Average Rectified (Io) | 1A DC |
| Max Reverse Voltage (DC) | 400V |
| Average Rectified Current | 1A |
| Reverse Recovery Time | 30 ns |
| Max Repetitive Reverse Voltage (Vrrm) | 400V |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet