| Parameters | |
|---|---|
| Case Connection | ISOLATED |
| Forward Current | 400mA |
| Operating Temperature - Junction | -65°C~175°C |
| Output Current-Max | 0.4A |
| Max Reverse Voltage (DC) | 225V |
| Average Rectified Current | 400mA |
| Max Repetitive Reverse Voltage (Vrrm) | 225V |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AA |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 1997 |
| JESD-609 Code | e0 |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Additional Feature | METALLURGICALLY BONDED |
| HTS Code | 8541.10.00.70 |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| Reference Standard | MIL |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Power Dissipation-Max | 0.5W |
| Element Configuration | Single |
| Speed | Standard Recovery >500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 50nA @ 225V |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 400mA |