| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Package / Case | MELF |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD OVER COPPER |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Additional Feature | METALLURGICALLY BONDED |
| HTS Code | 8541.10.00.50 |
| Max Power Dissipation | 1.5W |
| Technology | ZENER |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 225 |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Number of Elements | 1 |
| Polarity | UNIDIRECTIONAL |
| Element Configuration | Single |
| Diode Type | ZENER DIODE |
| Power Dissipation | 1.5W |
| Case Connection | ISOLATED |
| Max Reverse Leakage Current | 50nA |
| Test Current | 7mA |
| Reference Voltage | 36V |
| Zener Voltage | 36V |
| Voltage Tol-Max | 5% |
| Voltage Tolerance | 5% |
| Radiation Hardening | Yes |
| RoHS Status | Non-RoHS Compliant |