 
    | Parameters | |
|---|---|
| Factory Lead Time | 5 Weeks | 
| Mounting Type | Through Hole | 
| Number of Pins | 14 | 
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | 
| Contact Material - Mating | Beryllium Copper | 
| Contact Material - Post | Brass | 
| Operating Temperature | 105°C | 
| Published | 2012 | 
| Series | Correct-A-Chip® 354W00 | 
| JESD-609 Code | e0 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Termination | Solder | 
| ECCN Code | EAR99 | 
| Additional Feature | STANDARD: UL 94V-0 | 
| Contact Finish - Mating | Gold | 
| Current Rating (Amps) | 3A | 
| Pitch - Mating | 0.100 2.54mm | 
| Number of Contacts | 14 | 
| Contact Finish - Post | Tin-Lead | 
| Device Socket Type | IC SOCKET | 
| Pitch - Post | 0.050 1.27mm | 
| Convert From (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing | 
| Convert To (Adapter End) | SOWIC | 
| Contact Finish Thickness - Mating | 10.0μin 0.25μm | 
| Contact Finish Thickness - Post | 200.0μin 5.08μm | 
| Material Flammability Rating | UL94 V-0 | 
| RoHS Status | ROHS3 Compliant |