| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Mount | Through Hole |
| Material | FR4 Epoxy Glass |
| Package Accepted | SOIC |
| Packaging | Box |
| Published | 2009 |
| Series | Correct-A-Chip® 1109814 |
| Size / Dimension | 0.375Dia 9.53mm |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Number of Positions | 8 |
| Additional Feature | ADAPTER |
| Contact Finish - Mating | TIN (200)/TIN LEAD OVER NICKEL |
| Number of Contacts | 8 |
| Lead Length | 3.175mm |
| Device Socket Type | IC SOCKET |
| Proto Board Type | SMD to DIP |
| Board Thickness | 0.062 1.57mm 1/16 |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Lead Free |