10M04SAU169C8G
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 169-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 169 |
| HTS Code | 8542.39.00.01 |
| Voltage - Supply | 2.85V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B169 |
| Number of I/O | 130 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 4000 |
| Total RAM Bits | 193536 |
| Number of LABs/CLBs | 250 |
| RoHS Status | RoHS Compliant |
10M04SAU169C8G Overview
A 169-LFBGA package is provided with this component. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. Fpga chips is programmed wFpga chipsh 130 I/Os for transferring data in a more coherent manner. To form a fundamental building block, there are 4000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 2.85V~3.465V. FPGAs belonging to the MAX? 10 series are a type of FPGA that belong to the MAX? 10 series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has a total of 169 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 193536 bFpga chipss. 250 LABs/CLBs are configured on this FPGA.
10M04SAU169C8G Features
130 I/Os
Up to 193536 RAM bits
10M04SAU169C8G Applications
There are a lot of Intel 10M04SAU169C8G FPGAs applications.
- Development Boards and Shields for Microcontrollers
- Aerospace and Defense
- Computer hardware emulation
- Medical imaging
- Digital signal processing
- Wired Communications
- Security systems
- Artificial intelligence (AI)
- Cryptography
- Electronic Warfare